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Recommended Land Pattern
Routing Examples
Outline of Substrate
8 Bit , 3 x 3 Array
(10X)
1.27 mm pitch land
patterns are shown.
5 mil line widths shown.
Blind via to Vtt
reference plane layer.
PCB Pad Diameter
Solder Mask Dia = Pad
Diameter +.15mm (.006 inch)
Signal
Lines
Open via’s on top of
land pads are not
recommended due to
solder wicking.
32 Bit , 3 x 12 Array
(5X)
1.00mm Pitch (B7) = 0.51mm/.020 inch (minimum)
1.27mm pitch (B6) = 0.64mm/.025 inch (minimum)
For .006" Thick Solder Paste Stencil, Aperture Opening Should
be Equal to the PCB Pad Diameter.
Refer to www.ctscorp.com/components/clearone.asp for
additional PCB design information
Frequency P erform ance (5 0 oh m Ne tw ork )
Signal
Lines
16 Bit , 3 x 6 Array
(10X)
Cross Talk Performance (50 ohm Network )
Aggressor
H
F
E
100
90
80
F requency R esponse for 50 ohm Netw ork
1nS
250mV
I
A
B
D
C
70
60
50
40
30
20
10
Aggressor on
Lead A
250mV 1nS
Rise Time
Victim B
Victim C
Victim D
Victim E
Measured
Voltage
(Peak to Peak)
3.3 mV
1.9 mV
1.5 mV
1.5 mV
Aggressor on
Lead B
250mV 1nS
Rise Time
Victim A
Victim C
Victim D
Victim E
Measured
Voltage
(Peak to Peak)
3.2 mV
2.7 mV
1.8 mV
1.4 mV
0
Victim F
Victim H
1.5 mV
2.1 mV
Victim F
Victim H
1.5 mV
1.5 mV
M Hz
Victim I
3.3 mV
Victim I
2.0 mV
? 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
www.ctscorp.com
Page 2
GTL, GTL+, AGTL+ Terminator
March 06
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